Archive: March 28, 2024

Peikko Gulf Expands Ras Al Khaimah Facility to Enhance Manufacturing for Construction Industry

Ras Al Khaimah, 28 March 2024: International supplier of building materials, Peikko Gulf expanded its Ras Al Khaimah facility to boost its manufacturing capabilities by around 40%. With the facility now spanning nearly 23,000 m2 and new machinery added to its existing fleet, the company will serve the growing market needs and take on larger projects in the region.

Peikko Gulf is a subsidiary of Finland-based Peikko Group which was established in 1965, catering to 33 countries globally. The Al Hamra, Ras Al Khaimah manufacturing unit was set up in 2010 to produce precast connections and DELTABEAM® for the GCC, Middle Eastern, African, and Indian markets.

Global Data’s recent analysis indicates that the UAE’s construction market was valued at USD 94 billion in 2023 and is expected to grow at an annual average growth rate of over 3% from 2025 to 2028, reaching a projected value of more than USD 133 billion by 2027. This optimistic outlook for the UAE’s construction industry suggests that suppliers and manufacturers of building materials, such as Peikko, are likely to see an increase in demand, opening up further opportunities for growth.

Topi Paananen, entrepreneur and CEO of Peikko Group, said, “This expansion is a significant milestone for us. It’s driven by our commitment to innovation and serving our customers on larger projects. Ras Al Khaimah’s strategic location has been instrumental in our success, allowing us to effectively reach our target markets across the GCC, Middle East, Africa, and beyond. Peikko is poised to continue its growth trajectory, responding proactively to the evolving needs of the construction industry, with RAKEZ’s continuous cooperation and support in facilitating business growth.”

Ramy Jallad, RAKEZ Group CEO, said, “We are thrilled to see Peikko Gulf expand their operations with us. Their growth is demonstrative of the advantages Ras Al Khaimah offers to the manufacturers and suppliers of building materials in the midst of the region’s booming construction sector. The increasing real estate projects across the Gulf and beyond underscore the rise in demand for innovative and efficient building solutions, which Peikko Gulf is well-positioned to cater to. RAKEZ is committed to ensuring continued support for Peikko and all construction players in our business community, so they not only meet the demands of this vibrant sector but also thrive and expand their global footprint.”

Shopaholic Job Ad goes viral – Over 2.000 applicants in under 18 hours

There has been a huge interest for the unusual job opportunity as “Shopaholic”.

The biggest crypto marketplace is launching a new payment card soon. To gather feedback on the card, the company decided to set out a job ad for Shopaholic.

The successful candidate will not just enjoy a generous salary and free accommodation in a luxurious hotel – they will also have the surely hard work assignment of “buying things and keeping them”.

After just a few hours, the post was already viral. People are commenting in the thousands, and Bitrefill has received over 2.000 applications within 18 hours.

According to the company, this is not a joke, but a quite serious job opportunity. They are releasing a crypto payment card, and simply need people to test it.

“Since we are launching a new payment card soon, it felt natural to reach out to our users to help us try it. Never could we have imagined a response like this!”, Sergej Kotliar CEO Bitrefill

Southco Introduces New R4-50 Heavy-Duty Electronic Rotary Latch with Integrated Sensor

28th Mar 2024: Southco has introduced a new R4-50 Heavy-Duty Electronic Rotary Latch with an integrated sensor and sealed electronic actuation, expanding its rotary latch line with options offering increased security and remote access control for demanding environments.

Offering high security, quick actuation speed, and exceptional cycle life, the latest addition to the Heavy-Duty Rotary Latch line is designed for applications where durability and reliability are critical. As an FMVSS 206 capable solution for high-strength door retention, the R4-50 is made for last-mile delivery applications where constant use and unpredictable conditions are the norm.

The new R4-50 combines these traits with electronic actuation and monitoring to verify door security. The latch actuates reliably under high loads in under one second, and electronic access technology gives users convenient remote control actuation at all times. The integrated sensor communicates when the latch is closed and the door striker is present to confirm that the door is secured. The entire electronic actuation system is sealed to protect against environmental conditions.

All of this comes in a device built to last. With a cycle life five times longer than other electronic rotary latches, the R4-50 Heavy-Duty Rotary Latch will be a reliable solution for years after installation, even in the most demanding environments.

Chargebacks911 Appoints Roger Alexander as Advisor to Board and CEO,

LONDON, UK — 28 Mar 2024: Chargebacks911, the leading chargeback technology platform, announced the appointment of leading payments industry professional Roger Alexander as Advisor to the Board and CEO.

In his new role, Alexander will serve as a key advisor to Chargebacks911’s Advisory Board and its CEO, Monica Eaton, assisting the company with its expansion initiatives, including the highly-anticipated launch of its dispute resolution solution set to address the record spike of authorised push payment (APP) fraud claims.

According to UK Finance, APP fraud losses in the UK reached £239.3 million in the first half of 2023, most of which stemmed from online purchasing scams where customers were tricked into paying money for products that never arrived. To help fight losses attributed to APP fraud, the UK recently proposed an amendment to its Payment Services Regulations (PSR) that would enable banks and payment services to delay payment processing up to four business days (currently D+1) in instances where fraud or dishonesty is suspected.

This amendment is set to be enacted when the PSR’s new reimbursement requirement for APP fraud kicks in on Oct. 7, after which payment service providers (PSP) will be liable for reimbursing 50 percent of monetary losses to victims of APP fraud within the faster payments system. As the government looks to address APP fraud and other digital scam tactics, collaboration and innovation from service providers within the payments industry—including Chargebacks911—is desperately needed.

To better help address these issues facing banks, PSPs and merchants in the UK, Alexander will be lending his expert insights to Chargebacks911 to help them create the most effective solution possible. When asked his primary reason for joining the company, Alexander expressed his admiration for Chargebacks911’s visionary leadership and ambitious growth plans for both their U.S. and European operations.

“Monica and I have an extensive professional relationship, and I was immediately drawn to her vision for the future of Chargebacks911 and how they look to positively disrupt the way transaction disputes are currently being resolved,” said Alexander. “The company’s innovative solutions and services represent the tipping point in the payments industry, and I am honoured to now be a part of this journey.”

Alexander brings with him a wealth of experience, having served in various leadership roles within the payments and financial services sectors, including more than a decade in directorial roles at Barclays and subsequently as the CEO of Switch (the UK’s Debit Card) and President of Elavon Merchant Services Europe. He is currently a strategic advisor for Tarci and Pennies, a major UK charity, and previously held key NED positions with ACI Worldwide, Caxton and Valitor, among others. With over 36 years of payments experience, Alexander is poised to address the pressing challenges and opportunities facing the industry today.

“Fraud remains a constant challenge for organisations worldwide, but it also presents opportunities for innovative solutions,” Alexander explained. “Chargebacks911 is uniquely positioned to address this challenge, and my role will be to ensure that our knowledge and experience are aligned to develop products and services that serve the evolving needs of banks, PSPs and merchants.”

Reflecting on Chargebacks911’s competitive edge, Alexander pointed to the company’s status as an original disruptor in dispute resolution. The fintech company, founded in 2011, was the first global entity dedicated to managing, mitigating and preventing chargebacks.

Monica Eaton, CEO of Chargebacks911, welcomed Alexander to the team, stating, “I’ve looked up to Roger since I heard him speak at one of the first industry events I ever attended, where he posed the question, ‘Is it consumer behaviour or technological evolution?’ – as an approach to the cause of chargebacks and fraud. Today, there’s no better way to phrase how fraud is disrupting payments. Adjustments on both sides are requisite. Roger’s vast experience and strategic insights will be incredibly valuable as we continue to drive innovation and growth in the industry. We are thrilled to have him on board and look forward to leveraging his expertise to further elevate Chargebacks911’s solutions for banks, PSPs and merchants.”

Alexander’s appointment underscores Chargebacks911’s commitment to delivering cutting-edge solutions and expertise to meet the evolving needs of the payments industry worldwide.

“With his extensive intuition and insights built on years of industry experience, Roger will bring an invaluable perspective to ensure our chargeback solutions address the post-transaction challenges affecting the industry head on,” said Guy Harris, Chairman of Chargebacks911. “Meeting the needs of UK banks , PSPs and merchants means working together with the brightest minds in payments, and that’s exactly what we have in Roger.”

IDTechEx Explores Technology Trends in Dielectric Materials for Next Generation 2.5D and 3D Semiconductor Packaging

-Dr Yu-Han Chang, Senior Technology Analyst at IDTechEx

The semiconductor industry continually pushes packaging technology boundaries to meet the demand for higher chip performance and efficiency. Bandwidth is one of the critical factors defining the amount of data transmitted between dies on a package. Bandwidth, crucial for communication speed and efficiency, is impacted by factors such as IO/mm and Datarate/IO, which are, in turn, influenced by the dielectric materials selected for 2.5D and 3D packaging. This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx’s market report on the topic, “Materials and Processing for Advanced Semiconductor Packaging 2024-2034”.

Scope of “Materials and Processing for Advanced Semiconductor Packaging 2024-2034”. Source: IDTechEx

2.5D packaging:

For 2.5D packaging, achieving high bandwidth relies on the redistribution layer (RDL) within the package, where features like Line/Space (L/S), via, and pad dimensions are important. However, traditional inorganic dielectric materials like SiO2, though capable of achieving fine L/S, suffer from high dielectric constants (Dk=3.9) and are tied to the Si manufacturing technique. This hinders high-speed communication and presents costly challenges. Consequently, researchers are exploring organic alternatives with lower dielectric constants to enhance performance and reduce costs.

Organic dielectric materials emerge as promising alternatives for advanced semiconductor packaging, offering lower dielectric constants and cost advantages. However, selecting suitable organic dielectrics demands careful consideration of key parameters. IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report identifies five critical parameters crucial for organic dielectrics, including Dk (dielectric constant) and Df (loss tangent), CTE (Coefficient of Thermal Expansion), Elongation, Young’s modulus, and Moisture absorption. Ideally, one would expect to have materials that exhibit low Dk and Df, compatible CTE with Si and Cu, high elongation value, and a moderate Young’s modulus to provide stability to the package. However, material selection entails trade-offs; for example, low Dk polymers may exhibit higher coefficients of thermal expansion (CTE), impacting device reliability and packaging architectures. Thus, achieving a balance among these parameters is critical for successful material selection in semiconductor packaging.

3D packaging:

Reducing the pitches between solder bumps has been a continuous advancement in the evolution of 3D packaging. However, such an approach presents challenges in establishing reliable electrical connections due to reduced bump height and surface area, necessitating precise manufacturing processes. Thermocompression Bonding (TCB) addresses this by enabling fine-pitch bonding as small as 10μm, although issues such as Intermetallic Compound (IMC) formation and solder ball bridging persist. To overcome these challenges, Cu-Cu Hybrid Bonding technology embeds metal contacts between dielectric materials and employs heat treatment for copper atom diffusion, eliminating soldering-related bridging problems and enhancing reliability in high-performance component packaging. It is considered a promising solution for the semiconductor industry, pushing the boundaries of miniaturization and performance in electronic devices.

Currently, hybrid bonding relies on inorganic dielectric materials like SiO2 or SiCN for insulation, which struggle with achieving fine-scale topography patterns and demand front-end manufacturing techniques. Alternatively, organic dielectrics, akin to the benefit it brings to 2.5D packaging, offer benefits such as low-k properties, reducing RC delay and insertion loss, resisting Cu migration, and tolerating defects and warpage better. However, using organic dielectrics for 3D hybrid bonding is still in the R&D phase due to challenges like elevated bonding temperatures (memory applications limit the bonding temperature to be below 250°C and in certain applications (such as displays) that contain sensitive materials embedded in the deck that cannot sustain high temperatures, the bonding temperature requirement must be reduced to 150°C. Furthermore, CMP compatibility with polymers remains a critical issue. Half-cured polymer’s characteristics, including low modulus, viscoelastic behavior, and adhesion, pose challenges for ensuring Cu surface reliability during CMP. Modulus differences between Cu and polymer further complicate Cu protrusion formation.

IDTechEx’s “Materials and Processing for Advanced Semiconductor Packaging 2024-2034” report suggests that if their properties are enhanced, organic dielectrics may become viable for hybrid bonding. If successful, integrating organic materials into mass production processes could prompt OSAT companies to adopt hybrid bonding more widely. This shift could broaden the technology’s availability beyond a few foundries, as organic dielectrics offer the potential to ease stringent manufacturing and cleanroom standards associated with inorganic materials.

The report offers a structured overview of advanced semiconductor packaging in four main sections. The first part covers technology, trends, applications, and the ecosystem. The second part delves into 2.5D packaging processes, exploring dielectric materials, RDL fabrication, and material selection. Detailed analyses, player evaluations, and future trends are provided. Moving beyond 2.5D, the third part focuses on Cu-Cu hybrid bonding for 3D die stacking, offering insights into manufacturing processes, material selection, and case studies. Finally, the report includes a 10-year market forecast for Organic Dielectric Advanced Semiconductor Packaging, providing industry perspectives on market growth and trends.