Breaking New Ground: Polymatech Electronics Showcases Sapphire & 6G Tech at ISPEC 2025
Hyderabad, 17th March 2025: Polymatech Electronics, the country’s first opto-semiconductor company, headquartered in Chennai, India, announced the launch of its latest innovations at ISPEC 2025, held at Mahatma Mandir, Convention and Exhibition Centre, Gujarat. The esteemed Chief Minister of Gujarat, Shri Bhupendra Rajnikant Patel, officially launched the product, alongside Eswara Rao Nandam, CEO and Managing Director of Polymatech Electronics, and Anis Jouini, General Manager of ECM Greentech. This momentous occasion reinforces Polymatech’s dedication to advancing India’s semiconductor manufacturing capabilities.
Polymatech introduced groundbreaking semiconductor products: Sapphire Ingot, Sapphire Wafer, and the 6G Telecom Die. Sapphire ingots and wafers play a vital role in the semiconductor industry, valued for their exceptional mechanical strength, thermal conductivity, electrical insulation, and optical transparency. These materials serve as key components in various applications, including LED substrates for GaN-based LEDs, power devices and laser diodes that require efficient heat dissipation, RF devices in mobile phones benefiting from high dielectric strength, and semiconductor wafers used in high-frequency and microwave technologies. Additionally, sapphire’s durability makes it ideal for electronics operating in extreme conditions, such as space and military applications.
Meanwhile, the 6G Telecom Die is engineered for high-frequency communication, enabling ultra-fast data transfer, AI-driven networks, and massive IoT connectivity. With applications in millimetre-wave (mmWave) and terahertz bands, it plays a critical role in high-speed modulation, energy-efficient performance, and advanced antenna systems for next-generation telecom infrastructure. These innovations reinforce Polymatech’s commitment to strengthening India’s semiconductor ecosystem and positioning the country as a key player in the global supply chain.
Speaking on this milestone, Eswara Rao Nandam, CEO and Managing Director of Polymatech Electronics, stated, “India’s semiconductor industry is poised to contribute $100 billion to the global market, which is projected to reach $1 trillion by 2032. Polymatech is proud to be at the forefront of this transformation, driving self-reliance in advanced chip manufacturing. With the launch of our Sapphire Ingots, Sapphire Wafers, and 6G Telecom Die, we are strengthening India’s position in the global semiconductor supply chain and enabling the nation to compete at the highest level. As we advance toward this trillion-dollar future, our focus remains on innovation, collaboration, and building a world-class semiconductor ecosystem that will propel India to global leadership.”
Anis Jouini, General Manager, ECM Greentech, added, “The launch of Sapphire Ingots, Sapphire Wafers, and the 6G Telecom Die is a testament to Polymatech’s commitment to advancing semiconductor technology and strengthening India’s role in the global supply chain. By leveraging cutting-edge manufacturing and packaging capabilities, we are driving innovation, reducing dependency on imports, and positioning India as a key player in high-performance semiconductor solutions for critical industries worldwide.”
Polymatech and ECM France have set up a Joint Venture Company already and developing Ingot and Wafers for Semi-Conductor Industry. Polymatech Electronics envisions India as a global leader in semiconductor manufacturing, driven by strong investments, government support, and a skilled workforce. With the market set to grow from USD 6.67 billion in 2024 to USD 14.09 billion by 2032, the demand for advanced domestic production is more pressing than ever. Through innovation, research, and strategic partnerships, Polymatech is committed to strengthening India’s position in the global semiconductor value chain.
